Sintering of Inkjet-Printed Silver Nanoparticles at Room Temperature Using Intense Pulsed Light

被引:149
作者
Kang, J. S. [1 ]
Ryu, J. [1 ]
Kim, H. S. [2 ]
Hahn, H. T. [1 ]
机构
[1] Univ Calif Los Angeles, Mech & Aerosp Engn Dept, Los Angeles, CA 90095 USA
[2] Hanyang Univ, Dept Mech Engn, Seoul 133791, South Korea
基金
新加坡国家研究基金会;
关键词
Intense pulsed light; silver; nanoparticle; sintering; THERMAL-DEGRADATION; FILMS; ELECTRONICS; PARTICLES; CIRCUITS; SIZE;
D O I
10.1007/s11664-011-1711-0
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Intense pulsed light (IPL) was used to sinter printed silver nanoink patterns consisting of 20-nm to 40-nm silver nanoparticles dispersed in diethylene glycol (DEG). Three consecutive pulses at 50 J/cm(2) in less than 30 ms was sufficient to adequately sinter silver nanoink patterns for printed electronics without degradation of the substrates. This is an exceptionally short time compared with that of the conventional thermal sintering process. On the sintered conductive silver patterns, neck-like junctions between nanoparticles were observed using scanning electron microscopy (SEM). The melting temperature, 194.1A degrees C, of silver nanoparticles was found using differential scanning calorimetry (DSC). Also, x-ray diffraction (XRD) was used to find the grain size of the printed silver nanoink patterns. The IPL-sintered silver pattern had a grain size of 86.3 +/- A 7.2 nm. From this work, it was found that the IPL-sintered silver pattern had a low resistivity of 49 +/- A 3 n Omega m, which is low enough to be used for printed electronics.
引用
收藏
页码:2268 / 2277
页数:10
相关论文
共 24 条
[1]   Picosecond thermal pulses in thin metal films [J].
Al-Nimr, MA ;
Arpaci, VS .
JOURNAL OF APPLIED PHYSICS, 1999, 85 (05) :2517-2521
[2]  
Bidoki SM, 2005, AATCC REV, V5, P11
[3]   SIZE EFFECT ON MELTING TEMPERATURE OF GOLD PARTICLES [J].
BUFFAT, P ;
BOREL, JP .
PHYSICAL REVIEW A, 1976, 13 (06) :2287-2298
[4]  
Chipman R., 1995, Handbook of Optics, VII
[5]  
DIMOPLON W, 1972, CHEM ENG-NEW YORK, V79, P64
[6]   Low-cost all-polymer integrated circuits [J].
Drury, CJ ;
Mutsaers, CMJ ;
Hart, CM ;
Matters, M ;
de Leeuw, DM .
APPLIED PHYSICS LETTERS, 1998, 73 (01) :108-110
[7]  
Ghosh M.K., 1996, Polyimides: Fundamentals and Applications
[8]   EFFECT OF SIMULATED LOW-EARTH-ORBIT RADIATION ON POLYIMIDES (UV DEGRADATION STUDY) [J].
HILL, DJT ;
RASOUL, FA ;
FORSYTHE, JS ;
ODONNELL, JH ;
POMERY, PJ ;
GEORGE, GA ;
YOUNG, PR ;
CONNELL, JW .
JOURNAL OF APPLIED POLYMER SCIENCE, 1995, 58 (10) :1847-1856
[9]   The effects of copper oxides on the thermal degradation of bismaleimide triazine prepreg [J].
Hong, SG ;
Yeh, CS .
POLYMER DEGRADATION AND STABILITY, 2004, 83 (03) :529-537
[10]   On the applicability of the x-ray diffraction line profile analysis in extracting grain size and microstrain in nanocrystalline materials [J].
Jiang, HG ;
Rühle, M ;
Lavernia, EJ .
JOURNAL OF MATERIALS RESEARCH, 1999, 14 (02) :549-559