The importance of surface treatment to the anodic oxidation behaviour of Al-Cu alloys

被引：92

作者：

Habazaki, H ^{[1
]}

Paez, MA ^{[1
]}

Shimizu, K ^{[1
]}

Skeldon, P ^{[1
]}

Thompson, GE ^{[1
]}

Wood, GC ^{[1
]}

Zhou, X ^{[1
]}

机构：

[1] KEIO UNIV,DEPT CHEM,YOKOHAMA,KANAGAWA 223,JAPAN

来源：

CORROSION SCIENCE | 1996年 / 38卷 / 07期

关键词：

alloy; aluminium; RES; anodic films;

D O I：

10.1016/0010-938X(96)00184-9

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The anodic oxidation of Al-0.9 at%Cu alloy has been investigated, focusing on the effect of a mechanical polishing pre-treatment on incorporation of copper ions into the anodic film and the accumulation of copper atoms in the alloy just beneath the alloy/film interface. For the particular alloy and anodizing conditions, a relatively pure alumina film is formed to thickness of about 170 nm with associated progressive accumulation of copper atoms in the alloy at the alloy/film interface. The thickness of the copper-enriched layer is about 2 nm and the average composition approaches about 42 at%Cu. Only on achieving this level of enrichment are copper ions incorporated into the anodic film. The copper ions are more mobile than aluminium ions and hence, are able to reach the film/electrolyte interface during subsequent film growth. Copyright (C) 1996 Elsevier Science Ltd.

引用

页码：1033 / 1042

页数：10

共 11 条

[1] USE OF RUTHERFORD BACKSCATTERING TO STUDY BEHAVIOR OF ION-IMPLANTED ATOMS DURING ANODIC-OXIDATION OF ALUMINUM - AR, KR, XE, K, RB, CS, CL, BR, AND I [J].