Drop impact survey of portable electronic products

被引：65

作者：

Lim, CT ^{[1
]}

Ang, CW ^{[1
]}

Tan, LB ^{[1
]}

Seah, SKW ^{[1
]}

Wong, EH ^{[1
]}

机构：

[1] Natl Univ Singapore, Impact Mech Lab, Dept Mech Engn, Singapore 119260, Singapore

来源：

53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS | 2003年

关键词：

D O I：

10.1109/ECTC.2003.1216265

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

A common cause of failure in portable electronic products is drop impact. Electronic products subjected to impact and shock can sustain major functional and physical damage such as internal component failures and cracking of external casings. This paper examines the impact behavior of several mobile phones and personal digital assistants (PDAs) at various impact orientations using an orientation controlled drop tester [1]. The drop tester holds the product at a specified orientation and releases the product just before impact. A high-speed camera is used, to verify the impact orientation. Of interest are the strains and shock level induced around key electronic packages within each product, and the impact force. An understanding of the shock induced at different impact orientations will help in the design of more reliable and robust products.

引用

页码：113 / 120

页数：8

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