Fabrication of three-dimensional microstructures by electrochemically welding structures formed by microcontact printing on planar and curved substrates

被引:25
作者
Jackman, RJ [1 ]
Brittain, ST [1 ]
Whitesides, GM [1 ]
机构
[1] Harvard Univ, Dept Chem & Chem Biol, Cambridge, MA 02138 USA
基金
美国国家科学基金会; 加拿大自然科学与工程研究理事会;
关键词
electrochemical deposition; fabrication; microcontact printing; three-dimensional microstructures;
D O I
10.1109/84.679396
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper describes two convenient techniques for the fabrication of three-dimensional (3-D) structures with micron-sized features. The methods use microcontact printing (mu CP) to define patterns with feature sizes as small as 20 mu m both on planar substrates and on cylinders (diameter similar to 2 mm), Electrodeposition serves as a micron-scale tool for metal deposition and welding that transforms these patterned surfaces and cylinders into metallic complex 3-D microstructures (e.g., tetrahedra). Final tetrahedra (similar to 2-cm sides) have feature sizes as small as 50 mu m.
引用
收藏
页码:261 / 266
页数:6
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