Fabrication of three-dimensional microstructures by electrochemically welding structures formed by microcontact printing on planar and curved substrates
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作者:
Jackman, RJ
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Harvard Univ, Dept Chem & Chem Biol, Cambridge, MA 02138 USAHarvard Univ, Dept Chem & Chem Biol, Cambridge, MA 02138 USA
Jackman, RJ
[1
]
Brittain, ST
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Harvard Univ, Dept Chem & Chem Biol, Cambridge, MA 02138 USAHarvard Univ, Dept Chem & Chem Biol, Cambridge, MA 02138 USA
Brittain, ST
[1
]
Whitesides, GM
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Harvard Univ, Dept Chem & Chem Biol, Cambridge, MA 02138 USAHarvard Univ, Dept Chem & Chem Biol, Cambridge, MA 02138 USA
Whitesides, GM
[1
]
机构:
[1] Harvard Univ, Dept Chem & Chem Biol, Cambridge, MA 02138 USA
This paper describes two convenient techniques for the fabrication of three-dimensional (3-D) structures with micron-sized features. The methods use microcontact printing (mu CP) to define patterns with feature sizes as small as 20 mu m both on planar substrates and on cylinders (diameter similar to 2 mm), Electrodeposition serves as a micron-scale tool for metal deposition and welding that transforms these patterned surfaces and cylinders into metallic complex 3-D microstructures (e.g., tetrahedra). Final tetrahedra (similar to 2-cm sides) have feature sizes as small as 50 mu m.