Microcoils fabricated by UV depth lithography and galvanoplating

被引:32
作者
Lochel, B
Maciossek, A
Rothe, M
Windbracke, W
机构
[1] Fraunhofer-Inst. Siliziumtechnologie, D-14199 Berlin
关键词
photoresist; thick layers; UV patterning; electrodeposition; microcoils;
D O I
10.1016/S0924-4247(97)80034-9
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Three-dimensional (3D) UV microforming delivers promising results for advanced surface micromachining. This low-cost technology, a combination of UV patterning of very thick photoresist layers and moulding of the resulting patterns by electrodeposition, opens a wide range of applications. It allows the use of materials with interesting properties that could not be provided by standard processes. Furthermore, this method can be carried out directly on pre-processed chips. The practical application of the technology is demonstrated by planar and 3D microcoils.
引用
收藏
页码:663 / 668
页数:6
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