A contact-type piezoresistive micro-shear stress sensor for above-knee prosthesis application

被引:49
作者
Hsieh, MC
Fang, YK
Ju, MS
Chen, GS
Ho, JJ
Yang, CH
Wu, PM
Wu, GS
Chen, TYF
机构
[1] Natl Cheng Kung Univ, Dept Mech Engn, Man Machine Lab, Tainan 701, Taiwan
[2] Fortune Inst Technol, Dept Elect Engn, Chi Shan 701, Taiwan
关键词
finite element method; micro-electro-mechanical system; piezoresistive; shear-stress sensor; transducer;
D O I
10.1109/84.911100
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A prototype contact-type micro piezoresistive shear-stress sensor that can be utilized to measure the shear stress between skin of stump and socket of above-knee (AK) prosthesis was designed, fabricated and tested. Micro-electro-mechanical system (MEMS) technology has been chosen for the design because of the low cost, small size and adaptability to this application. In this paper, the finite element method (FEM) package ANSYS has been employed for the stress analysis of the micro shear-stress sensors. The sensors contain two transducers that will transform the stresses into an output voltage. In the developed sensor, a 3000x 3000x300 mum(3) square membrane is formed by bulk micromaching of an n-type (100) monolithic silicon. The piezoresistive strain gauges were implanted with boron ions with a dose of 10(15) atoms/cm(2), Static characteristics of the shear sensor were determined through a series of calibration tests. The fabricated sensor exhibits a sensitivity of 0.13 mV/mA-MPa for a 1.4 N full scales shear force range and the overall mean hysteresis error is than 3.5%. In addition, the results simulated by FEM are validated by comparison with experimental investigations.
引用
收藏
页码:121 / 127
页数:7
相关论文
共 16 条
  • [1] Gragg J. E., 1984, IEEE SOL STAT SENS W, P21
  • [2] Improved micro thermal shear-stress sensor
    Huang, JB
    Tung, S
    Ho, CM
    Liu, C
    Tai, YC
    [J]. IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, 1996, 45 (02) : 570 - 574
  • [3] KANDA Y, 1982, IEEE T ELECT DEV JAN, V29
  • [4] Lebar A M, 1996, IEEE Trans Rehabil Eng, V4, P310, DOI 10.1109/86.547932
  • [5] METHOD FOR IN-SHOE SHEAR-STRESS MEASUREMENT
    LORD, M
    HOSEIN, R
    WILLIAMS, RB
    [J]. JOURNAL OF BIOMEDICAL ENGINEERING, 1992, 14 (03): : 181 - 186
  • [6] Naylor P. F. D., 1955, BRIT J DERMATOL, V67, P240
  • [7] PADMANABHAN A, 1997, P 1997 INT C SOL STA
  • [8] Microfabricated shear stress sensors, Part 1: Design and fabrication
    Pan, T
    Hyman, D
    Mehregany, M
    Reshotko, E
    Garverick, S
    [J]. AIAA JOURNAL, 1999, 37 (01) : 66 - 72
  • [9] SILICON AS A MECHANICAL MATERIAL
    PETERSEN, KE
    [J]. PROCEEDINGS OF THE IEEE, 1982, 70 (05) : 420 - 457
  • [10] REIBER GE, 1994, J REHABIL RES DEV, V31, P357