Surface passivated function of GaAs MSM-PDs using photoelectrochemical oxidation method

被引:13
作者
Lee, CT [1 ]
Lee, HY
机构
[1] Natl Cheng Kung Univ, Inst Microelect, Dept Elect Engn, Tainan 701, Taiwan
[2] Natl Huwei Univ Sci & Technol, Inst Electroopt & Mat Sci, Yunlin 632, Taiwan
关键词
GaAs; InAlGaP; metal-semiconductor-metal photodetectors (MSM-PDs); oxide passivation layer; photoelectrochemical (PEC) oxidation method;
D O I
10.1109/LPT.2004.839447
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
To improve the performance of GaAs metal-semiconductor-metal photodetectors (MSM-PDs), we directly grew an oxide passivation layer in regions between the interdigitated electrodes of MSM-PDs, using the photoelectrochemical oxidation method. The measured dark current of passivated MSM-PDs was comparatively lower than that of unpassivated devices for all of the applied voltages. The breakdown voltages of MSM-PDs with and without oxide passivation layer were 52.5 and 42.5 V, respectively. The benefits of incorporating the oxide passivation layer will possibly lead to a sizable reduction of surface states that in return will help to decrease the probability of surface breakdown. Also, it should improve the rejection ratio of MSM-PDs.
引用
收藏
页码:462 / 464
页数:3
相关论文
共 8 条
[1]   Evaluation of Schottky contact parameters in metal-semiconductor-metal photodiode structures [J].
Averine, S ;
Chan, YC ;
Lam, YL .
APPLIED PHYSICS LETTERS, 2000, 77 (02) :274-276
[2]   The effect of surface passivation on the microwave characteristics of undoped AlGaN/GaN HEMT's [J].
Green, BM ;
Chu, KK ;
Chumbes, EM ;
Smart, JA ;
Shealy, JR ;
Eastman, LF .
IEEE ELECTRON DEVICE LETTERS, 2000, 21 (06) :268-270
[3]   Silicon dioxide passivation of in P/InGaAs metal-semiconductor-metal photodetectors [J].
Kollakowski, S ;
Schade, U ;
Bottcher, EH ;
Kuhl, D ;
Bimberg, D ;
Ambree, P ;
Wandel, K .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1996, 14 (03) :1712-1718
[4]   Metal-oxide-semiconductor devices using Ga2O3 dielectrics on n-type GaN [J].
Lee, CT ;
Chen, HW ;
Lee, HY .
APPLIED PHYSICS LETTERS, 2003, 82 (24) :4304-4306
[5]   GaN MOS device using SiO2-Ga2O3 insulator grown by photoelectrochemical oxidation method [J].
Lee, CT ;
Lee, HY ;
Chen, HW .
IEEE ELECTRON DEVICE LETTERS, 2003, 24 (02) :54-56
[6]   Thermal reliability and characterization of InGaP Schottky contact with Ti/Pt/Au metals [J].
Lee, CT ;
Shiao, HP ;
Yeh, NT ;
Tsai, CD ;
Lyu, YT ;
Tu, YK .
SOLID-STATE ELECTRONICS, 1997, 41 (01) :1-5
[7]   Influence of MgO and Sc2O3 passivation on AlGaN/GaN high-electron-mobility transistors [J].
Luo, B ;
Johnson, JW ;
Kim, J ;
Mehandru, RM ;
Ren, F ;
Gila, BP ;
Onstine, AH ;
Abernathy, CR ;
Pearton, SJ ;
Baca, AG ;
Briggs, RD ;
Shul, RJ ;
Monier, C ;
Han, J .
APPLIED PHYSICS LETTERS, 2002, 80 (09) :1661-1663
[8]   CURRENT TRANSPORT IN METAL-SEMICONDUCTOR-METAL (MSM) STRUCTURES [J].
SZE, SM ;
COLEMAN, DJ ;
LOYA, A .
SOLID-STATE ELECTRONICS, 1971, 14 (12) :1209-&