Impact of the transient formation of molecular hydrogen on the microcrack nucleation and evolution in H-implanted Si (001)

被引:61
作者
Personnic, S. [1 ]
Bourdelle, K. K. [1 ]
Letertre, F. [1 ]
Tauzin, A. [2 ]
Cherkashin, N. [3 ]
Claverie, A. [3 ]
Fortunier, R. [4 ]
Klocker, H. [4 ]
机构
[1] Silicon Insulator Technol SOITEC, F-38926 Crolles, France
[2] CEA GRE, CEA DRT LETI, F-38054 Grenoble 9, France
[3] CNRS, CEMES, nMat Grp, F-31055 Toulouse, France
[4] EMSE, F-42023 St Etienne 2, France
关键词
D O I
10.1063/1.2829807
中图分类号
O59 [应用物理学];
学科分类号
摘要
We study the implant-induced hydrogenated defects responsible for the Smart Cut (TM) layer transfer of Si (001) films. Different experimental methods are used to quantify the time dependence of the defect evolution and interactions during isothermal annealings. An optical characterization technique was developed for the statistical analysis of the formation and growth of micrometer size microcracks in the buried implanted layer. We show that the formation of molecular hydrogen is dominated by a transient phenomenon related to the rapid dissociation of the hydrogenated point defects. The impact of the H-2 formation kinetics on the microcrack evolution is described and the physical mechanisms involved in their growth are identified. A comprehensive picture of the fracture phenomenon in H implanted Si leading to the full layer transfer is proposed and discussed. (c) 2008 American Institute of Physics.
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页数:9
相关论文
共 21 条
  • [1] The generic nature of the Smart-Cut® process for thin film transfer
    Aspar, B
    Moriceau, H
    Jalaguier, E
    Lagahe, C
    Soubie, A
    Biasse, B
    Papon, AM
    Claverie, A
    Grisolia, J
    Benassayag, G
    Letertre, F
    Rayssac, O
    Barge, T
    Maleville, C
    Ghyselen, B
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2001, 30 (07) : 834 - 840
  • [2] SILICON-ON-INSULATOR MATERIAL TECHNOLOGY
    BRUEL, M
    [J]. ELECTRONICS LETTERS, 1995, 31 (14) : 1201 - 1202
  • [3] STATE AND MOTION OF HYDROGEN IN CRYSTALLINE SILICON
    DEAK, P
    SNYDER, LC
    CORBETT, JW
    [J]. PHYSICAL REVIEW B, 1988, 37 (12): : 6887 - 6892
  • [4] Thermal evolution of hydrogen related defects in hydrogen implanted Czochralski silicon investigated by Raman spectroscopy and atomic force microscopy
    Duengen, W.
    Job, R.
    Ma, Y.
    Huang, Y. L.
    Mueller, T.
    Fahrner, W. R.
    Keller, L. O.
    Horstmann, J. T.
    Fiedler, H.
    [J]. JOURNAL OF APPLIED PHYSICS, 2006, 100 (03)
  • [5] Defect-induced dissociation of H2 in silicon
    Estreicher, SK
    Hastings, JL
    Fedders, PA
    [J]. PHYSICAL REVIEW B, 1998, 57 (20) : R12663 - R12665
  • [6] A lower bound on implant density to induce wafer splitting in forming compliant substrate structures
    Freund, LB
    [J]. APPLIED PHYSICS LETTERS, 1997, 70 (26) : 3519 - 3521
  • [7] A transmission electron microscopy quantitative study of the growth kinetics of H platelets in Si
    Grisolia, J
    Ben Assayag, G
    Claverie, A
    Aspar, B
    Lagahe, C
    Laanab, L
    [J]. APPLIED PHYSICS LETTERS, 2000, 76 (07) : 852 - 854
  • [8] SIMS depth profiling of ultrashallow P, Ge and As implants in Si using MCs2+ ions
    Holliger, P
    Laugier, F
    Dupuy, JC
    [J]. SURFACE AND INTERFACE ANALYSIS, 2002, 34 (01) : 472 - 476
  • [9] Hydrogen molecules trapped by multivacancies in silicon
    Ishioka, K
    Kitajima, M
    Tateishi, S
    Nakanoya, K
    Fukata, N
    Mori, T
    Murakami, K
    Hishita, S
    [J]. PHYSICAL REVIEW B, 1999, 60 (15): : 10852 - 10854
  • [10] JOHNSON NM, 1987, PHYS REV B, V35, P4166, DOI 10.1103/PhysRevB.35.4166