Glancing angle deposition to modify microstructure and properties of sputter deposited chromium thin films

被引:87
作者
Lintymer, J [1 ]
Gavoille, J [1 ]
Martin, N [1 ]
Takadoum, J [1 ]
机构
[1] ENSMM, LMC, F-25030 Besancon, France
关键词
grain boundary; chromium; nano-indentation; roughness; conductivity;
D O I
10.1016/S0257-8972(03)00413-4
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The glancing angle deposition (GLAD) technique was used to deposit chromium thin films by dc magnetron sputtering. With suitable operating conditions to favour a columnar microstructure and by controlling the orientation of the substrate relative to the impinging vapour flux, an inclined columnar film microstructure was produced. A systematic change of the angle 'alpha' between the incident atom flux and the substrate normal was correlated with the angle 'beta' between the column's axis and the substrate normal. For every angular range (a increases from 0 to 50degrees), the results were corroborated with empirical relationships between angles alpha and beta. The influence of the deposition at oblique incidence on the surface morphology and the microstructure was investigated by atomic force microscopy and by scanning electron microscopy. The evolution of the crystallographic structure was also examined by X-ray diffraction vs. the angle of the incident flux. Measurements of the conductivity and nano-indentation tests were also performed in order to discuss the change of the mechanical and electrical behaviours, as a function of the orientated microstructure of the coatings. (C) 2003 Elsevier Science B.V All rights reserved.
引用
收藏
页码:316 / 323
页数:8
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