Kinetic selection of morphology and growth velocity in electrochemical deposition

Ramified copper deposits were formed by electrochemical deposition from well supported acid sulfate solution under conditions of mixed kinetic and transport control. The growth velocity, morphology, and global rate of growth were measured over a ran,ae of applied driving force. Chloride was added to the solutions to modify the interfacial kinetics, and the kinetic parameters were obtained as a function of surface orientation by polarization measurements on copper single crystals. Chloride produces an anisotropic differential resistance to growth at the interface and a tendency toward high-velocity dendritic growth with formation of open low-density deposits.