Implanted gallium ion concentrations of focused-ion-beam prepared cross sections

被引:42
作者
Ishitani, T [1 ]
Koike, H
Yaguchi, T
Kamino, T
机构
[1] Hitachi Ltd, Instrument Div, Hitachinaka 3128504, Japan
[2] Hitachi Instruments Engn Co Ltd, Techno Res Lab, Hitachinaka 3128504, Japan
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 1998年 / 16卷 / 04期
关键词
D O I
10.1116/1.590106
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A gallium (Ga) focused-ion-beam (FIB) has been popularly used to prepare cross-sectional samples for transmission electron microscopes (TEMs) and scanning electron or ion microscopes. However, characteristics of the FIB-prepared cross sections such as ion concentration and radiation damage have been little studied either in theory or in experiment. In the present study, cross sections prepared by 30 keV Ga FIB are modeled using a combination of analytical and Monte Carlo methods to calculate the implanted Ga concentration. It is found that the Si/W layered sample is cross sectioned at grazing angles beta approximate to 2.5 degrees and 6 degrees for these layers, respectively. The implanted Ga ions for the cross-sectioned Si and W layers are concentrated very near their surfaces of < 10 nm to yield the Ga concentrations C-Ga Of about 4 and 9 at % for these layers, respectively. Although there is some differences in sample materials between the calculations and the experiments, the calculated C-Ga values for Si and W layers roughly agree with the experimental values for the magneto-optical disk TEM sample. This agreement firmly supports the present modeling of FIB-milled cross sections. (C) 1998 American Vacuum Society.
引用
收藏
页码:1907 / 1913
页数:7
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