Solder parameter sensitivity for CSP life-time prediction using simulation-based optimization method

被引：11

作者：

Vandevelde, B ^{[1
]}

Beyne, E ^{[1
]}

Zhang, K ^{[1
]}

Caers, J ^{[1
]}

机构：

[1] IMEC, B-3001 Louvain, Belgium

来源：

51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE | 2001年

关键词：

D O I：

10.1109/ECTC.2001.927736

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Finite element modelling is widely used for estimating the solder joint reliability of electronic packages. However, the solder properties are strong process and geometry dependent. Even for the same type of solder, measurements conducted by different people at different locations show different results, due to differences in application conditions, benching etc. Those differences may lead to difference in constitutive equations and/or the parameter values. Therefore the effect of the solder parameter variation and parameter sensitivity should be taken into account before a reliable solder fatigue prediction can be made. In this research, simulation-based optimisation method is used to investigate the sensitivity of the chosen solder parameters for the solder fatigue prediction using inelastic strain criterion.

引用

页码：281 / 287

页数：7

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