A new generation of high voltage MOSFETs breaks the limit line of silicon

For the first time a new device concept for high voltage power devices has been realized in silicon. Our 600 V COOLMOS(TM) reaches an area specific on-resistance of typically 3.5 Omega.mm(2). Our technology thus offers a shrink factor of 5 versus the actual state of the art in power MOSFETs. The device concept is based on charge compensation in the drift region of the transistor (1-3). We increase the doping of the vertical drift region roughly by one order of magnitude and counterbalance this additional charge by the implementation of fine structured columns of the opposite doping type. The blocking voltage of the transistor remains thus unaltered. The charge compensating columns do not contribute to the current conduction during the turn-on state. Nevertheless the drastically increased doping of the drift region allows the above mentioned reduction of the on-resistance.