Fundamentals of micromechanical thermoelectric sensors -: art. no. 044906

被引:68
作者
Dürig, U [1 ]
机构
[1] IBM Res GMBH, Zurich Res Lab, CH-8803 Ruschlikon, Switzerland
关键词
D O I
10.1063/1.2006968
中图分类号
O59 [应用物理学];
学科分类号
摘要
The thermal and electrical properties of a thin heater strip made of silicon, consisting of a low-doped electrical resistor connected to highly doped long legs, are discussed based on analytical models for the heat and the electrical current transport. Such heater strips are used, for example, as sensitive position and height sensors in local-probe storage applications. The aim of the paper is to provide a thorough understanding of the important physical mechanisms and scaling laws, and thus to establish a solid basis for the directed engineering of such sensors. In particular, the dynamic response is treated in full generality, including the intricate electrothermal coupling arising from the highly temperature-dependent resistivity of the Si heater element. (c) 2005 American Institute of Physics.
引用
收藏
页数:14
相关论文
共 15 条
[1]  
[Anonymous], 1958, Elementary Statistical Physics
[2]  
Bae JH, 2003, PROC IEEE MICR ELECT, P24
[3]   Ultrahigh-density atomic force microscopy data storage with erase capability [J].
Binnig, G ;
Despont, M ;
Drechsler, U ;
Häberle, W ;
Lutwyche, M ;
Vettiger, P ;
Mamin, HJ ;
Chui, BW ;
Kenny, TW .
APPLIED PHYSICS LETTERS, 1999, 74 (09) :1329-1331
[4]   Nanoscale thermal transport [J].
Cahill, DG ;
Ford, WK ;
Goodson, KE ;
Mahan, GD ;
Majumdar, A ;
Maris, HJ ;
Merlin, R ;
Phillpot, SR .
JOURNAL OF APPLIED PHYSICS, 2003, 93 (02) :793-818
[5]   Phonon heat conduction in nanostructures [J].
Chen, G .
INTERNATIONAL JOURNAL OF THERMAL SCIENCES, 2000, 39 (04) :471-480
[6]  
Chui BW, 1999, MICROSCALE THERM ENG, V3, P217
[7]   Comparison of thermal and piezoresistive sensing approaches for atomic force microscopy topography measurements [J].
King, WP ;
Kenny, TW ;
Goodson, KE .
APPLIED PHYSICS LETTERS, 2004, 85 (11) :2086-2088
[8]   Design of atomic force microscope cantilevers for combined thermomechanical writing and thermal reading in array operation [J].
King, WP ;
Kenny, TW ;
Goodson, KE ;
Cross, GLW ;
Despont, M ;
Dürig, UT ;
Rothuizen, H ;
Binnig, G ;
Vettiger, P .
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2002, 11 (06) :765-774
[9]   Micro-thermal analysis: techniques and applications [J].
Pollock, HM ;
Hammiche, A .
JOURNAL OF PHYSICS D-APPLIED PHYSICS, 2001, 34 (09) :R23-R53
[10]  
SHI I, 2004, APPL SCANNING PROBE