Thermal conductivity and interfacial resistance in single-wall carbon nanotube epoxy composites

被引：323

作者：

Bryning, MB ^{[1
]}

Milkie, DE ^{[1
]}

Islam, MF ^{[1
]}

Kikkawa, JM ^{[1
]}

Yodh, AG ^{[1
]}

机构：

[1] Univ Penn, Dept Phys & Astron, Philadelphia, PA 19104 USA

来源：

APPLIED PHYSICS LETTERS | 2005年 / 87卷 / 16期

基金：

美国国家科学基金会; 美国国家航空航天局;

关键词：

D O I：

10.1063/1.2103398

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

We report thermal conductivity measurements of purified single-wall carbon nanotube (SWNT) epoxy composites prepared using suspensions of SWNTs in N-N-Dimethylformamide (DMF) and surfactant stabilized aqueous SWNT suspensions. Thermal conductivity enhancement is observed in both types of composites. DMF-processed composites show an advantage at SWNT volume fractions between phi similar to 0.001 to 0.005. Surfactant processed samples, however, permit greater SWNT loading and exhibit larger overall enhancement (64 +/- 9)% at phi similar to 0.1. The enhancement differences are attributed to a ten-fold larger SWNT/solid-composite interfacial thermal resistance in the surfactant-processed composites compared to DMF-processed composites. The interfacial resistance is extracted from the volume fraction dependence of the thermal conductivity data using effective medium theory. [C. W. Nan, G. Liu, Y. Lin, and M. Li, Appl. Phys. Lett. 85, 3549 (2004)]. (C) 2005 American Institute of Physics.

引用

页码：1 / 3

页数：3

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