The EUV program at ASML:: an update

被引：22

作者：

Meiling, H ^{[1
]}

Banine, V ^{[1
]}

Kürz, P ^{[1
]}

Blum, B ^{[1
]}

Heerens, GJ ^{[1
]}

Harned, N ^{[1
]}

机构：

[1] ASML, NL-5500 AH Veldhoven, Netherlands

来源：

EMERGING LITHOGRAPHIC TECHNOLOGIES VII, PTS 1 AND 2 | 2003年 / 5037卷

关键词：

D O I：

10.1117/12.483706

中图分类号：

O43 [光学];

学科分类号：

070207 ; 0803 ;

摘要：

With the realisation of the alpha-tool, ASML is progressing with the pre-commercialisation phase of its EUVL development. We report on the progress in the development of several key modules of the cc-tool, including the source, wafer stage and reticle stage, wafer handling, baseframe, and optics modules. We demonstrate that the focus sensor meets its vacuum requirements, and that both stages after limited servo optimisation approach the required scanning performance. A particle detection system has been build for the qualification of the reticle handling module, and preliminary results show that 50nm particles can be detected. The optics lifetime program showed substantial progress by utilising caplayers to MoSi samples in order to suppress oxidation caused by H2O molecules under EUV illumination: a suppression greater than or equal to100x is achieved, compared to uncapped MoSi.

引用

页码：24 / 35

页数：12

共 13 条

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