Simulation and measurements of charge collection in monolithic active pixel sensors

被引:45
作者
Deptuch, G
Winter, M
Dulinski, W
Husson, D
Turchetta, R
Riester, JL
机构
[1] ULP, IN2P3, IReS, F-67037 Strasbourg, France
[2] ULP, IN2P3, LEPSI, F-67037 Strasbourg, France
关键词
solid-state detectors; simulation; CMOS; monolithic pixels;
D O I
10.1016/S0168-9002(01)00361-8
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
A preliminary study of the charge collection in the recently proposed Monolithic Active Pixel Sensor devices for minimum ionising particles tracking is presented. The baseline pixel architecture is similar to a visible light CMOS camera, emerged as a competitor to widespread CCDs. Free electrons created by an impinging particle are collected by a photodiode from a thin partially depleted epitaxial silicon layer allowing 100% of fill-factor. Such a structure is fabricated using standard CMOS process. The sensor and associated readout electronics are integrated onto the same wafer. resulting in a low cost. high resolution and possibly thin detector. The crucial points of a CMOS detector are the time and the efficiency of the charge collection. These factors, in spite of undeniable advantages of CMOS detectors, can limit their performances. The detailed 3-D simulations using commercially available ISE-TCAD package are carried out in order to study a charge collection process. Although it is dominated by thermal diffusion, more than 1000 electrons are collected in the 3 x 3 pixels cluster within a time of 100 ns in a 15 mum thick epitaxial layer. Simulation results are compared to measurements performed on the prototype APS CMOS MIMOSA using either a fast Infrared (IR) laser or a high-energy particle beam as an excitation source. (C) 2001 Elsevier Science B.V. All rights reserved.
引用
收藏
页码:92 / 100
页数:9
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