Improving the thermal stability of one-component polyurethane adhesives by adding filler material

被引：20

作者：

Clauss, Sebastian ^{[1
]}

Allenspach, Karin ^{[1
]}

Gabriel, Joseph ^{[2
]}

Niemz, Peter ^{[1
]}

机构：

[1] ETH, Inst Bldg Mat, CH-8093 Zurich, Switzerland

[2] Purbond, CH-6203 Sempach, Switzerland

来源：

WOOD SCIENCE AND TECHNOLOGY | 2011年 / 45卷 / 02期

关键词：

WOOD;

D O I：

10.1007/s00226-010-0321-y

中图分类号：

S7 [林业];

学科分类号：

0829 ; 0907 ;

摘要：

The aim of the current study is to improve the thermal stability of one-component moisture-curing polyurethane adhesives. The approach here tends to add suitable filler materials to the adhesive and to study the resulting effects. The investigation covers mechanical tests to determine the shear strength of the glued wood joints according to EN 302-1 (2004). Furthermore, the distribution of the filler material within the adhesive is shown by means of environmental scanning electron microscopy combined with energy-dispersive X-ray spectroscopy analysis. The thermal stability of the glued wood joints could be significantly improved by adding chalk with a volume fraction of 30% to the adhesive.

引用

页码：383 / 388

页数：6

共 12 条

[1]

[Anonymous], 2004, 3021 EN

[2] Structure-property relationships in one-component polyurethane adhesives for wood: Sensitivity to low moisture content [J].