Development of a wide-tuning-range two-parallel-plate tunable capacitor for integrated wireless communication systems

被引:39
作者
Zou, J [1 ]
Liu, C [1 ]
Schutt-Ainé, JE [1 ]
机构
[1] Univ Illinois, Dept Elect & Comp Engn, Urbana, IL 61801 USA
关键词
MEMS; tunable capacitor; varactor; wireless communication;
D O I
10.1002/mmce.1040
中图分类号
TP39 [计算机的应用];
学科分类号
081203 ; 0835 ;
摘要
This paper reports on the development of a micromachined parallel-plate tunable capacitor with a wide tuning range. Different from conventional two -parallel-plate tunable capacitors, this tunable capacitor consists of one suspended top plate and two fixed bottom plates. One fixed plate and the top plate form a variable capacitor, while the other one provides necessary electrostatic actuation. Among the fabricated prototype devices, a maximum controllable tuning range of 69.8%@1 MHz has been obtained experimentally, exceeding the theoretical limit (50%) of conventional two-parallel-plate tunable capacitors. A component quality factor (Q) of 30@5 GHz and a self-resonant frequency far beyond 5 GHz have been achieved. The fabrication process is compatible with the existing standard IC (integrated circuit) technology, which makes it suitable for integrated wireless communication applications. (C) 2001 John Wiley & Sons, Inc.
引用
收藏
页码:322 / 329
页数:8
相关论文
共 24 条
[1]   Microwave inductors and capacitors in standard multilevel interconnect silicon technology [J].
Burghartz, JN ;
Soyuer, M ;
Jenkins, KA .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1996, 44 (01) :100-104
[2]   Multilevel-spiral inductors using VLSI interconnect technology [J].
Burghartz, JN ;
Jenkins, KA ;
Soyuer, M .
IEEE ELECTRON DEVICE LETTERS, 1996, 17 (09) :428-430
[3]   Micromachined electro-mechanically tunable capacitors and their applications to RF IC's [J].
Dec, A ;
Suyama, K .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1998, 46 (12) :2587-2596
[4]  
FENG Z, 2000, SOL STAT SENS ACT WO, P255
[5]   High-rate through-mold electrodeposition of thick (>200 μm) NiFe MEMS components with uniform composition [J].
Leith, SD ;
Schwartz, DT .
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 1999, 8 (04) :384-392
[6]  
*MICR TECHN INC, MEMCAD 4 5 US GUID
[7]  
Muldavin JB, 1999, IEEE MTT S INT MICR, P1511, DOI 10.1109/MWSYM.1999.780241
[8]  
MULHERN GT, 1993, 7 INT C SOL STAT SEN, P296
[9]   Micromachined devices for wireless communications [J].
Nguyen, CTC ;
Katehi, LPB ;
Rebeiz, GM .
PROCEEDINGS OF THE IEEE, 1998, 86 (08) :1756-1768
[10]  
Nguyen CTC, 1995, ULTRASON, P489, DOI 10.1109/ULTSYM.1995.495626