Sublithographic nanofabrication technology for nanocatalysts and DNA chips
被引:51
作者:
Choi, YK
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机构:
Univ Calif Berkeley, Dept Elect Engn & Comp Sci, Berkeley, CA 94720 USAUniv Calif Berkeley, Dept Elect Engn & Comp Sci, Berkeley, CA 94720 USA
Choi, YK
[1
]
Lee, JS
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机构:Univ Calif Berkeley, Dept Elect Engn & Comp Sci, Berkeley, CA 94720 USA
Lee, JS
Zhu, J
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机构:Univ Calif Berkeley, Dept Elect Engn & Comp Sci, Berkeley, CA 94720 USA
Zhu, J
Somorjai, GA
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机构:Univ Calif Berkeley, Dept Elect Engn & Comp Sci, Berkeley, CA 94720 USA
Somorjai, GA
Lee, LP
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机构:Univ Calif Berkeley, Dept Elect Engn & Comp Sci, Berkeley, CA 94720 USA
Lee, LP
Bokor, J
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机构:Univ Calif Berkeley, Dept Elect Engn & Comp Sci, Berkeley, CA 94720 USA
Bokor, J
机构:
[1] Univ Calif Berkeley, Dept Elect Engn & Comp Sci, Berkeley, CA 94720 USA
[2] Univ Calif Berkeley, Dept Bioengn, Berkeley, CA 94720 USA
[3] Univ Calif Berkeley, Dept Chem, Berkeley, CA 94720 USA
来源:
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
|
2003年
/
21卷
/
06期
关键词:
D O I:
10.1116/1.1627805
中图分类号:
TM [电工技术];
TN [电子技术、通信技术];
学科分类号:
0808 ;
0809 ;
摘要:
We describe parallel processes for nanometer pattern generation on a wafer scale with resolution comparable to the best electron beam lithography. Sub-10 nm linewidth is defined by a sacrificial ultrathin film deposited by low pressure chemical vapor deposition (LPCVD), in a process similar to formation of gate sidewall spacers in CMOS processing. We further demonstrate a method called iterative spacer lithography (ISL), in which the process is repeated multiple times with alternating materials in order to multiply the pattern density. Silicon structures with sub-10 nm width fabricated by this process were used as a mold in nanoimprint lithography and lift-off patterning of sub-30 nm platinum nanowires for use in experiments on chemical catalysis. We also demonstrate a similar process called reversed spacer lithography (RSL) to form sub-10 nm fluid channels in poly-Si. This nanogap fluid channel device was used for label-free detection of DNA hybridization based on electrical sensing of dielectric changes in the gap. (C) 2003 American Vacuum Society.