Mechanical stress measurements using micro-Raman spectroscopy

被引:20
作者
De Wolf, I [1 ]
Maes, HE [1 ]
机构
[1] IMEC, B-3001 Louvain, Belgium
关键词
D O I
10.1007/s005420050134
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The application of micro-Raman spectroscopy for measurements of mechanical stress in silicon microelectronics devices is discussed. The advantages and disadvantages of the technique are shown through different examples such as Si3N4 and metal lines, isolation structures and solder bumps.
引用
收藏
页码:13 / 17
页数:5
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