Thermal contact resistance at low contact pressure: Effect of elastic deformation

被引：81

作者：

Bahrami, M ^{[1
]}

Yovanovich, MM ^{[1
]}

Culham, JR ^{[1
]}

机构：

[1] Univ Waterloo, Microelect Heat Transfer Lab, Waterloo, ON N2L 3G1, Canada

来源：

INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER | 2005年 / 48卷 / 16期

基金：

加拿大自然科学与工程研究理事会;

关键词：

thermal contact resistance; plastic/elastic deformation; low contact pressure; microhardness; surface roughness;

D O I：

10.1016/j.ijheatmasstransfer.2005.02.033

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

Existing models over-predict the thermal contact resistance of conforming rough joints at low contact pressures. However, the applicable pressure range in some applications such as microelectronics cooling is low. A new model is developed which is more suitable for low pressures. The effect of elastic deformations beneath the plastically deformed microcontacts is determined by superimposing normal deformations due to self and neighboring contact spots in an elastic half-space. A parametric study reveals that the elastic deformation effect is an important phenomenon at low contact pressures. The model is compared with data and good agreement is observed at low contact pressures. (c) 2005 Elsevier Ltd. All rights reserved.

引用

页码：3284 / 3293

页数：10

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