Four-point bend adhesion measurements of copper and permalloy systems

被引：39

作者：

Hughey, MP

Morris, DJ

Cook, RF

Bozeman, SP

Kelly, BL

Chakravarty, SLN

Harkens, DP

Stearns, LC

机构：

[1] Univ Minnesota, Dept Chem Engn & Mat Sci, Minneapolis, MN 55455 USA

[2] Seagate Technol, Bloomington, MN 55435 USA

来源：

ENGINEERING FRACTURE MECHANICS | 2004年 / 71卷 / 02期

关键词：

thin film; delamination; four-point bend; interfacial crack; stress corrosion cracking;

D O I：

10.1016/S0013-7944(03)00100-0

中图分类号：

O3 [力学];

学科分类号：

08 ; 0801 ;

摘要：

The four-point bend split-beam method is used to quantitatively determine the interfacial fracture resistance and crack velocity as a function of mechanical energy release rate of the weakest interface in a thin film stack. Various interfaces of importance to magnetic storage devices are studied, including copper or nickel-iron (permalloy) on silicon oxynitride with additional adhesion promoters. The dynamics and kinetics of the four-point bend test are fully elueidated. A model for environmentally-controlled crack growth previously applied to bulk ceramics is used here as a model for interfacial crack growth and is found to fit the kinetic data. (C) 2003 Elsevier Ltd. All rights reserved.

引用

页码：245 / 261

页数：17

共 25 条

[1] A NEW PROCEDURE FOR MEASURING THE DECOHESION ENERGY FOR THIN DUCTILE FILMS ON SUBSTRATES [J].

BAGCHI, A ;

LUCAS, GE ;

SUO, Z ;

EVANS, AG .

JOURNAL OF MATERIALS RESEARCH, 1994, 9 (07) :1734-1741

[2] CALCULATED ELASTIC-CONSTANTS FOR STRESS PROBLEMS ASSOCIATED WITH SEMICONDUCTOR DEVICES [J].

BRANTLEY, WA .

JOURNAL OF APPLIED PHYSICS, 1973, 44 (01) :534-535

[3] Role of passivation etch polymers in interfacial delamination for polymeric low-k dielectrics [J].

Breen, MR ;

Foster, CM ;

Bass, S ;

Lee, JJ ;

Mlynko, W .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2000, 18 (03) :1314-1321

[4] A test specimen for determining the fracture resistarim of bimaterial interfaces [J].

Charalambides, PG ;

Lund, J ;

Evans, AG ;

McMeeking, RM .

JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME, 1989, 56 (01) :77-82

[5] Mechanical and metallographic characterization of LIGA fabricated nickel and 80%Ni-20%Fe permalloy [J].

Christenson, TR ;

Buchheit, TE ;

Schmale, DT ;

Bourcier, RJ .

MICROELECTROMECHANICAL STRUCTURES FOR MATERIALS RESEARCH, 1998, 518 :185-190

[6] Which management of otitis media in Spain? [J].

Claros, P .

MEDECINE ET MALADIES INFECTIEUSES, 1997, 27 :38-39

[7] KINETICS OF INDENTATION CRACKING IN GLASS [J].

COOK, RF ;

LINIGER, EG .

JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 1993, 76 (05) :1096-1105

[8] Environmentally-controlled non-equilibrium crack propagation in ceramics [J].

Cook, RF .

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 1999, 260 (1-2) :29-40

[9] Adhesion and debonding of multi-layer thin film structures [J].

Dauskardt, R ;

Lane, M ;

Ma, Q ;

Krishna, N .

ENGINEERING FRACTURE MECHANICS, 1998, 61 (01) :141-162

[10] Young's modulus, yield strength and fracture strength of microelements determined by tensile testing [J].

Greek, S ;

Ericson, F .

MICROELECTROMECHANICAL STRUCTURES FOR MATERIALS RESEARCH, 1998, 518 :51-56

← 1 2 3 →