Recent advances and perspectives in synchrotron radiation TXRF

被引:14
作者
Baur, K
Brennan, S
Werho, D
Moro, L
Pianetta, P
机构
[1] SSRL SLAC, Stanford, CA 94309 USA
[2] Motorola Inc, Mesa, AZ 85202 USA
[3] SRI Int, Menlo Pk, CA 94025 USA
关键词
total reflection X-ray fluorescence; detection limit; synchrotron radiation;
D O I
10.1016/S0168-9002(01)00569-1
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
Total reflection X-ray fluorescence (TXRF) using Synchrotron Radiation is likely to be the most powerful nondestructive technique for the analysis of trace metal impurities on silicon wafer surfaces. Of fundamental importance in TXRF is the achievable sensitivity as characterized by the minimum detection limit. This work describes the progress we achieved recently at the Stanford Synchrotron Radiation Laboratory (SSRL) in minimum detection limits for transition metals and will give an estimate of what can be achieved using a third generation synchrotron radiation source such as SPEAR3. (C) 2001 Elsevier Science B.V. All rights reserved.
引用
收藏
页码:1198 / 1201
页数:4
相关论文
共 6 条
[1]  
Bertin E.P., 1975, Principles and Practice of X-ray Spectrometric Analysis
[2]   WIDE BAND-PASS APPROACHES TO TOTAL-REFLECTION X-RAY-FLUORESCENCE USING SYNCHROTRON-RADIATION [J].
BRENNAN, S ;
TOMPKINS, W ;
TAKAURA, N ;
PIANETTA, P ;
LADERMAN, SS ;
FISCHERCOLBRIE, A ;
KORTRIGHT, JB ;
MADDEN, MC ;
WHERRY, DC .
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT, 1994, 347 (1-3) :417-421
[3]  
BRENNAN S, 1993, APPL SYNCHROTRON RAD, V542, P125
[4]   TOTAL-REFLECTION X-RAY-FLUORESCENCE SPECTROSCOPY USING SYNCHROTRON-RADIATION FOR WAFER SURFACE TRACE IMPURITY ANALYSIS [J].
PIANETTA, P ;
TAKAURA, N ;
BRENNAN, S ;
TOMPKINS, W ;
LADERMAN, SS ;
FISCHERCOLBRIE, A ;
SHIMAZAKI, A ;
MIYAZAKI, K ;
MADDEN, M ;
WHERRY, DC ;
KORTRIGHT, JB .
REVIEW OF SCIENTIFIC INSTRUMENTS, 1995, 66 (02) :1293-1297
[5]   Application of synchrotron radiation to TXRF analysis of metal contamination on silicon wafer surfaces [J].
Pianetta, P ;
Baur, K ;
Singh, A ;
Brennan, S ;
Kerner, J ;
Werho, D ;
Wang, J .
THIN SOLID FILMS, 2000, 373 (1-2) :222-226
[6]  
Takaura N., 1995, ADV XRAY CHEM ANAL J, V26s, P113