High density plasma etching of low k dielectric polymers in oxygen-based chemistries

被引:34
作者
Fuard, D [1 ]
Joubert, O [1 ]
Vallier, L [1 ]
Bonvalot, M [1 ]
机构
[1] CNRS, CEA, LETI, Lab Technol Microelect, F-38054 Grenoble 9, France
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 2001年 / 19卷 / 02期
关键词
D O I
10.1116/1.1358856
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We have studied the etching of low dielectric constant polymers in halogen- and sulfur-free chemistries under various plasma operating conditions. The polymer graphitization phenomenon, which corresponds to the transformation of the aromatic hydrocarbon network into an amorphous carbon backbone, has been fully investigated under several plasma conditions by in situ mass spectrometry and quasi-in situ x-ray photoelectron spectroscopy (XPS). Profile control in high aspect ratio contact holes is obtained thanks to the formation of a passivation layer on the polymer sidewalls preventing the spontaneous chemical attacks by the oxygen reactive species of the plasma. XPS studies show that the passivation layer only forms under conditions where the plasma induces a polymer graphitization. Strong correlations are observed between plasma conditions leading to the polymer graphitization, the presence of heavy carbon byproducts detected in the plasma gas phase, and the passivation layer formation. (C) 2001 American Vacuum Society.
引用
收藏
页码:447 / 455
页数:9
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