Pit-free electropolishing of aluminum and its application for process chamber

被引:10
作者
Tajiri, K
Saito, Y
Yamanaka, Y
Kabeya, Z
机构
[1] Mitsubishi Heavy Ind Ltd, Minato Ku, Aichi 458, Japan
[2] KEK, High Energy Accelerator Res Org, Tsukuba, Ibaraki, Japan
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1998年 / 16卷 / 03期
关键词
D O I
10.1116/1.581258
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Aluminum is one of the candidate materials of the vacuum chamber and components in the ultra-large scale integration device production facilities, because of high thermal conductivity and minimizing weight. For that purpose, their surface must be smooth and passivated so as to have a low outgassing rate. An electropolishing method to obtain a mirror-finish and pit-free smooth surface has been developed by controlling the flow of the electrolytic fluid during polishing. The polished surface, which shows an average roughness of 0.03 mu m was found to be covered with an oxide film of 200 nm thick as determined by Auger electron spectroscopy, indicating a chemically stable surface. The outgassing rate measurement using a conduction-modulation method shows the value of 10(-10) Pa m(3) s(-1) m(-2), after baking treatment at 150 degrees C. (C) 1998 American Vacuum Society. [S0734-2101(98)01403-1].
引用
收藏
页码:1196 / 1200
页数:5
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