Properties of quad flat package joints using Sn-Zn-Bi solder with varying lead-plating materials

被引：11

作者：

Iwanishi, H

Hirose, A

Imamura, T

Tateyama, K

Mori, I

Kobayashi, KF

机构：

[1] Osaka Univ, Grad Sch Engn, Dept Mfg Sci, Suita, Osaka 5650871, Japan

[2] Toshiba Co Ltd, Corp Mfg Engn Ctr, Isogo Ku, Yokohama, Kanagawa 2350017, Japan

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2003年 / 32卷 / 12期

关键词：

Sn-Zn-Bi solder; lead plating; interfacial reaction; quad flat package (QFP); reliability;

D O I：

10.1007/s11664-003-0127-x

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The effects of plating materials (Sn-10Pb, Sn-3.5Ag, Sn-3Bi, Sn-0.7Cu, and Au/Pd/Ni) on Cu leads on quad flat package (QFP) joints using a Sn-8Zn-3Bi solder were investigated. The joints with Sn-3.5Ag plating and Sn-8Zn-3Bi solder had the slowest growth rate of interfacial reaction layers and the highest strength. The Ag dissolution into the interfacial reaction layers causes this increased strength. The Sn-Ag plating is the best plating material for Cu leads among the five kinds of plating using Sn-8Zn-3Bi solder.

引用

页码：1540 / 1546

页数：7

共 4 条

[1] Influence of interfacial reaction on reliability of QFP joints with Sn-Ag based Pb free solders [J].