Compressive behavior of an electrodeposited nanostructured copper at quasistatic and high strain rates

被引：62

作者：

Jia, D

Ramesh, KT

Ma, E

Lu, L

Lu, K

机构：

[1] Johns Hopkins Univ, Dept Mech Engn, Baltimore, MD 21218 USA

[2] Johns Hopkins Univ, Dept Mat Sci & Engn, Baltimore, MD 21218 USA

[3] Acad Sinica, Inst Met Res, State Key Lab RSA, Shenyang 110015, Peoples R China

来源：

SCRIPTA MATERIALIA | 2001年 / 45卷 / 05期

关键词：

nc-copper; TEM; grain boundary; stress-strain curve; high strain rate;

D O I：

10.1016/S1359-6462(01)01071-5

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Uniaxial compression experiments for an electrodeposited nanostructured copper were performed at quasistatic strain rates of 4 x 10(-4) s(-1) and high strain rates of 3 x 10(3)-2 x 10(4) s(-1). The mechanical behavior of the no-Cu, including strength, strain hardening and strain-rate dependence of flow stress, is presented. (C) 2001 Acta Materialia Inc. Published by Elsevier Science Ltd. All rights reserved.

引用

页码：613 / 620

页数：8

共 15 条

[1]

[Anonymous], I PHYS C SER

[2] Interface controlled diffusional creep of nanocrystalline pure copper [J].