Polymer-like organic thin films deposited by plasma enhanced chemical vapor deposition using the para-xylene precursor as low dielectric constant interlayer dielectrics for multilevel metallization

Polymer-like organic thin films were deposited by plasma enhanced chemical vapor deposition (PECVD) using the paraxylene precursor. The effect of the plasma power on the dielectric constant and thermal stability was significant. As the plasma power was increased from 5 W to 60 W the relative dielectric constant increased from 2.70 to 3.21. The film deposited at a higher plasma power showed higher thermal stability. The film deposited at 60 W was stable up to 450 degrees C. All the deposited films were insulating under an applied field of less than or equal to 1 MV/cm.