Automatic dose optimization system for resist cross-sectional profile in a electron beam lithography

被引:12
作者
Hirai, Y
Kikuta, H
Okano, M
Yotsuya, T
Yamamoto, K
机构
[1] Univ Osaka Prefecture, Coll Engn, Dept Mech Syst Engn, Osaka 5998531, Japan
[2] Osaka Sci & Technol Ctr, Izumi Ku, Osaka 5941157, Japan
[3] Nalux Co Ltd, Shimamoto, Osaka 6180001, Japan
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS | 2000年 / 39卷 / 12B期
关键词
electron beam lithography; proximity effect; exposure dose; cross-sectional profile; development;
D O I
10.1143/JJAP.39.6831
中图分类号
O59 [应用物理学];
学科分类号
摘要
A computer-aided dose optimization system to obtain a modified resist cross-sectional profile is demonstrated based on resist development simulation and an iteration procedure of the exposure dose profile for a positive electron beam resist. The absorbed energy in the resist by the electron beam exposure is evaluated by conventional Monte-Carlo simulation and the resist cross-sectional profile after development is predicted by a cell removal model. The exposure dose profile is optimized by an iteration procedure based on the predicted resist development profile. The exposure dosages at each point are corrected based on the difference of the average absorbed energy density between the desired developed surface and the predicted profile by the resist development simulation. The system is applied for blaze pattern fabrication for diffractive optical elements and a fine blaze pattern is successfully obtained.
引用
收藏
页码:6831 / 6835
页数:5
相关论文
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[11]  
VINCENT P, 1980, ELECTROMAGNETIC THEO