Investigation of the adhesion strength between molding compound and leadframe at higher temperatures

被引：21

作者：

Schmidt, R ^{[1
]}

Alpern, P ^{[1
]}

Plecher, K ^{[1
]}

Tilgner, R ^{[1
]}

机构：

[1] Siemens AG, Semicond Grp, Backend Operat, Qualif Strategy & IP Management,Syst Reliab, D-81617 Munich, Germany

来源：

2ND ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS | 1998年

关键词：

D O I：

10.1109/EPTC.1998.756028

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The popcorn effect is still a main failure source, if the reliability of surface mounted devices is concerned. For thin packages like P-TSOP or P-TQFP it was found, that after preconditioning lever 3 and level 1 the popcorn effect starts from the back side or the top side of the die pad, respectively. Adhesion tests at room temperature couldn't enlighten this difference, but rose even more questions. To clearify the situation we investigated the adhesion strength between molding compound and leadframe and between Ag coating and chip adhesive as a function of temperature, Ag coating and moisture content. We further report about investigations of the temperature dependence of different molding compounds and leadframes, especially about leadframes with a special coating which showed an increased adhesion strength in comparison to uncoated leadframes in former popcorn experiments and adhesion tests at room temperature.

引用

页码：349 / 353

页数：5

共 9 条

[1]

ALPERN P, 1992, IEEE T CHMT, P926

[2]

ALPERN P, UNPUB

[3]

Lee C, 1997, ELEC COMP C, P1049, DOI 10.1109/ECTC.1997.606300

[4] An analytical characterization and reliability testing of an adhesion enhancing Zn-Cr leadframe coating for popcorn prevention [J].

Lee, C ;

Hosler, W ;

Cerva, H ;

von Criegern, R ;

Parthasarathi, A .

48TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1998 PROCEEDINGS, 1998, :1154-1161

[5] A novel coupling agent based on Zn-Cr chemistry for enhanced moulding compound to leadframe adhesion and improved popcorn resistance [J].

Lee, C ;

Parthasarathi, A ;

Check-Eng, RT .

PROCEEDINGS OF THE 1997 1ST ELECTRONIC PACKAGING TECHNOLOGY CONFERENCE, 1997, :194-200

[6]

Nanbu S, 1985, P 23 INT REL PHYS S, P192

[7] CAUSES OF CRACKS IN SMD AND TYPE SPECIFIC REMEDIES [J].

OMI, S ;

FUJITA, K ;

TSUDA, T ;

MAEDA, T .

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1991, 14 (04) :818-823

[8]

PRUDHOMME M, 1994, INT RELIABILITY PHYS, P79

[9]

SCHMIDT R, UNPUB

← 1 →