Bottom-up assembly of large-area nanowire resonator arrays

被引:275
作者
Li, Mingwei [1 ]
Bhiladvala, Rustom B. [1 ,2 ]
Morrow, Thomas J. [3 ]
Sioss, James A. [3 ]
Lew, Kok-Keong [4 ]
Redwing, Joan M. [4 ]
Keating, Christine D. [3 ]
Mayer, Theresa S. [1 ,2 ]
机构
[1] Penn State Univ, Dept Elect Engn, University Pk, PA 16802 USA
[2] Penn State Univ, Mat Res Inst, University Pk, PA 16802 USA
[3] Penn State Univ, Dept Chem, University Pk, PA 16802 USA
[4] Penn State Univ, Dept Mat Sci & Engn, University Pk, PA 16802 USA
关键词
D O I
10.1038/nnano.2008.26
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Directed-assembly of nanowire-based devices' will enable the development of integrated circuits with new functions that extend well beyond mainstream digital logic. For example, nanoelectromechanical resonators are very attractive for chip-based sensor arrays' because of their potential for ultrasensitive mass detection(3-6). In this letter, we introduce a new bottom-up assembly method to fabricate large-area nanoelectromechanical arrays each having over 2,000 single-nanowire resonators. The nanowires are synthesized and chemically functionalized before they are integrated onto a silicon chip at predetermined locations. Peptide nucleic acid probe molecules attached to the nanowires before assembly maintain their binding selectivity and recognize complementary oligonucleotide targets once the resonator array is assembled. The two types of cantilevered resonators we integrated here using silicon and rhodium nanowires had Q-factors of similar to 4,500 and similar to 1,150, respectively, in vacuum. Taken together, these results show that bottom-up nanowire assembly can offer a practical alternative to top-down fabrication for sensitive chip-based detection.
引用
收藏
页码:88 / 92
页数:5
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