共 23 条
[1]
[Anonymous], INT TECHNOLOGY ROADM
[2]
BECKER JJ, UNPUB
[3]
Elers KE, 2002, CHEM VAPOR DEPOS, V8, P149, DOI 10.1002/1521-3862(20020704)8:4<149::AID-CVDE149>3.0.CO
[4]
2-F
[6]
Advanced CVD barrier technology for copper interconnect
[J].
ADVANCED INTERCONNECTS AND CONTACTS,
1999, 564
:269-280
[7]
Study on the characteristics of TiN thin film deposited by the atomic layer chemical vapor deposition method
[J].
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS,
2000, 18 (04)
:1595-1598
[9]
KIM D, UNPUB