共 19 条
[3]
DAIGLE B, 1996, P 46 IEEE EL COMP TE
[4]
DONALD SF, 1999, IEEE T ADV PACKAGING, V22, P153, DOI DOI 10.1109/6040.763186
[6]
Horn A. F., 1994, [No title captured], Patent No. 005358775
[9]
Laverghetta T.S., 1985, MICROWAVE MAT FABRIC
[10]
PROCESS CONSIDERATIONS IN THE FABRICATION OF FLUOROPOLYMER PRINTED-CIRCUIT BOARDS
[J].
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A,
1995, 18 (01)
:118-126