Polishing of polycrystalline diamond by the technique of dynamic friction. Part 2: Material removal mechanism

被引：81

作者：

Chen, Y. ^{[1
]}

Zhang, L. C. ^{[1
]}

Arsecularatne, J. A. ^{[1
]}

机构：

[1] Univ Sydney, Sch Aerosp Mech & Mechatron Engn, Sydney, NSW 2006, Australia

来源：

INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE | 2007年 / 47卷 / 10期

基金：

澳大利亚研究理事会;

关键词：

dynamic friction polishing; polycrystalline diamond; material removal mechanism;

D O I：

10.1016/j.ijmachtools.2006.11.003

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This paper investigates the material removal mechanisms of PCD using the dynamic friction polishing technique. Scanning electron microscopy, energy dispersive X-ray, X-ray diffraction and Raman spectroscopy were used to identify the mechanisms by analyzing the specimen surfaces and debris produced by polishing. It was found that the material removal occurred in a rather complex way, which can be a chemo-mechanical process, diffusion, oxidization and evaporation, or their combinations. (C) 2006 Elsevier Ltd. All rights reserved.

引用

页码：1615 / 1624

页数：10

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