Strategies for wafer-scale hot embossing lithography

被引：6

作者：

Scheer, HC ^{[1
]}

Schulz, H ^{[1
]}

Lyebyedyev, D ^{[1
]}

机构：

[1] Univ Gesamthsch Wuppertal, Dept Elect & Informat Engn, D-42097 Wuppertal, Germany

来源：

17TH EUROPEAN CONFERENCE ON MASK TECHNOLOGY FOR INTEGRATED CIRCUITS AND MICROCOMPONENTS | 2001年 / 4349卷

关键词：

D O I：

10.1117/12.425080

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

We summarise flow and filling effects detected during hot embossing lithography (HEL), which reflect the viscoelastic properties of the polymers as well as the specific processing conditions and stamp pattern configurations. In particular a delayed elastic recovery is reported, which is found in larger elevated stamp regions. The consequences of these effects for mask definition by HEL are discussed, and strategies for wafer-scale imprint are de-duced. Sucessful imprint of 4" wafers is demonstrated under adequate processing conditions.

引用

页码：86 / 89

页数：4

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