共 21 条
[2]
FILM REDEPOSITION ON VERTICAL SURFACES DURING REACTIVE ION ETCHING
[J].
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B,
1989, 7 (03)
:505-511
[5]
Angular dependence of the redeposition rates during SiO2 etching in a CF4 plasma
[J].
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS,
2001, 19 (03)
:730-735
[6]
Direct pattern etching for micromachining applications without the use of a resist mask
[J].
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B,
2000, 18 (06)
:2769-2773
[8]
REDEPOSITION KINETICS IN FLUOROCARBON PLASMA-ETCHING
[J].
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS,
1994, 12 (02)
:354-364