Heavy ion irradiation of thin gate oxides

被引:45
作者
Ceschia, M [1 ]
Paccagnella, A
Turrini, M
Candelori, A
Ghidini, G
Wyss, J
机构
[1] Univ Padua, Dipartimento Elettron & Informat, I-35131 Padua, Italy
[2] Ist Nazl Fis Nucl, Sez Padova, I-35131 Padua, Italy
[3] STMicroelect, I-20041 Agrate Brianza, Italy
关键词
D O I
10.1109/23.903821
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We have studied the gate leakage current after heavy ion irradiation of MOS capacitors with thin gate oxides. In 3-nm and 4-nm oxides radiation-induced soft breakdown (RSB) occurs even after ion fluences as small as 100 ion hits on the device surface. The RSB conductive paths likely reproduce the ion hit distribution: some of them can drive a substantial fraction of the whole gate leakage current. The bias applied during irradiation enhances the RSB current intensity but no critical field exists to ignite the RSB, which is observed also under nat-band. The irradiated 3-nm oxides show smaller current variations and random telegraph signal CRTS) noise than the 4-nm oxides, owing to the higher current driven in fresh devices by direct tunneling conduction. The RTS noise increases with the radiation dose; it can be described successfully neither by a Levy nor by a Gaussian distribution. In 6.5-nm and IO-nm thick oxides the defect clusters generated by heavy ion irradiation can produce RSB and RILC (radiation induced leakage current), which have not been observed after low LET irradiation, or electrical stresses.
引用
收藏
页码:2648 / 2655
页数:8
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