On-chip wiring design challenges for gigahertz operation

被引:133
作者
Deutsch, A [1 ]
Coteus, PW
Kopcsay, GV
Smith, HH
Surovic, CW
Krauter, BL
Edelstein, DC
Restle, PJ
机构
[1] IBM Corp, Thomas J Watson Res Ctr, Yorktown Hts, NY 10598 USA
[2] IBM Corp, Dev Lab S 390, Poughkeepsie, NY 12601 USA
[3] IBM Mircoelect, Austin, TX 78758 USA
关键词
lossy transmission-line modeling; on-chip interconnections; simulation; VLSI chip design;
D O I
10.1109/5.920582
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper reviews the status of present day on-chip wiring design methodologies and understanding. A brief explanation is given of the fundamental transmission-line properties that should be considered for accurate prediction of crosstalk, common-mode noise and clock skew. The deficiencies of RC-circuit representation are highlighted and design guidelines are given for using modeling and simulation techniques that have been previously used for package interconnections. Such techniques are believed to teach designers how to make better use of available technologies and help them architect systems that operate with many-GHz clock rates.
引用
收藏
页码:529 / 555
页数:27
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