共 65 条
[1]
ALFONSO S, 1999, IEEE T ADV PACKAGING, V22, P309
[2]
ALLER I, 2000, P ISSCC, P214
[3]
ARZ U, 2000, P IEEE 9 TOP M EL PE, P181
[4]
BALIGA J, 2000, SEMICONDUCTOR IN JUL
[5]
BENSCHNEIDER B, 2000, P 2000 IEEE INT SOL, P86
[6]
BUSWAS B, 1997, P 6 TOP M EL PERF EL, P57
[7]
CASES M, 1998, P IEEE 7 TOP M EL PE, P27
[8]
Cheng C., 2000, INTERCONNECT ANAL SY
[9]
Analysis and results of net coupling within a high performance microprocessor
[J].
ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING - IEEE 5TH TOPICAL MEETING,
1996,
:36-38