Integration of optical interconnects and optoelectronic elements on wafer-scale

被引：14

作者：

Dannberg, P ^{[1
]}

Erdmann, L ^{[1
]}

Krehl, A ^{[1
]}

Wächter, C ^{[1
]}

Bräuer, A ^{[1
]}

机构：

[1] Fraunhofer Inst IOF, D-07745 Jena, Germany

来源：

MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING | 2000年 / 3卷 / 5-6期

关键词：

optical interconnects; in-plane and plane-to-plane; 3D-waveguides; polymers; replication;

D O I：

10.1016/S1369-8001(00)00070-6

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The UV-reaction molding technology enabling for the fabrication of microoptical elements with rectangular, triangular or circular cross-sections (waveguides, prisms, lenses) in optical polymers is described. Multimode waveguide optical interconnects, coupling prisms and holding structures for fibers can be fabricated in one step. A three-dimensional monomode waveguide interconnection module is presented. Stability tests of the microoptical elements are reported. (C) 2001 Elsevier Science Ltd. All rights reserved.

引用

页码：437 / 441

页数：5