The evolution of build-up package technology and its design challenges

被引：42

作者：

Blackshear, ED

Cases, M

Klink, E

Engle, SR

Malfatt, RS

de Araujo, DN

Oggioni, S

LaCroix, LD

Wakil, JA

Hougham, GG

Pham, NH

Russell, DJ

机构：

[1] IBM Syst & Technol Grp, Austin, TX 78758 USA

[2] IBM Syst & Technol Grp, D-71032 Boblingen, Germany

[3] IBM Syst & Technol Grp, Endicott, NY 13760 USA

[4] IBM Syst & Technol Grp, Hopewell Jct, NY 12533 USA

[5] IBM Syst & Technol Grp, Vinerctae, Italy

[6] IBM Syst & Technol Grp, Essex Jct, VT 05452 USA

来源：

IBM JOURNAL OF RESEARCH AND DEVELOPMENT | 2005年 / 49卷 / 4-5期

关键词：

D O I：

10.1147/rd.494.0641

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

This paper reviews sequential build-up (SBU) laminate substrate development from its beginning in 1988. It reports on developments in this technology for IBM applications since its adoption in 2000. These laminated substrates are nonuniform structures composed of three elements: a core, build-up layers, and finishing layers. Each element has evolved to meet the demands of packaging applications. Thin-film. processing has greatly enhanced the wiring capability of SBU laminate substrates and has made this technology very suitable for high-performance designs. This paper focuses on the challenges encountered by IBM during the design, manufacture, and reliability testing phases of development of SBU substrates as solutions for application-specific integrated circuit (A SIC) and microprocessor packaging applications.

引用

页码：641 / 661

页数：21

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