Adhesion and stiction: Mechanisms, measurement techniques, and methods for reduction

被引:347
作者
Bhushan, B
机构
[1] Ohio State Univ, Nanotribol Lab Informat Storage, Columbus, OH 43210 USA
[2] Ohio State Univ, MEMS NEMS, Columbus, OH 43210 USA
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 2003年 / 21卷 / 06期
关键词
D O I
10.1116/1.1627336
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Solid-solid adhesion occurs at contacting asperities in two contacting solids. A thin liquid film with a small contact angle, present at the interface, can result in the so-called liquid-mediated adhesion. This may result in high adhesion during normal pull and high static friction during sliding, both commonly referred to as "stiction." The problem of high stiction is especially important in an interface involving two very smooth surfaces under lightly loaded conditions. This article provides a critical and comprehensive review of mechanisms of adhesion and stiction, various measurement techniques, and methods used to reduce stiction in magnetic storage devices and micro/nanoelectromechanical systems. (C) 2003 American Vacuum Society.
引用
收藏
页码:2262 / 2296
页数:35
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