Analysis of thin film polysilicon on graphite substrates deposited in a thermal CVD system

被引:10
作者
Angermeier, D [1 ]
Monna, R [1 ]
Slaoui, A [1 ]
Muller, JC [1 ]
机构
[1] Lab PHASE, UPR 292 CNRS, F-67037 Strasbourg 2, France
关键词
D O I
10.1016/S0022-0248(98)00142-0
中图分类号
O7 [晶体学];
学科分类号
0702 ; 070205 ; 0703 ; 080501 ;
摘要
Thin films of polycrystalline silicon of 10-30 mu m were grown on graphite substrates. The deposition experiments were conducted in a horizontal, atmospheric pressure RTCVD reactor from 800 to 1200 degrees C employing the precursor trichlorosilane (TCS) and the dopant trichloroborine (TCB) diluted in a hydrogen carrier gas. The polycrystalline Si layers were analyzed by means of Nomarski microscopy, scanning electron microscopy (SEM), X-ray diffraction (XRD), and by high-resolution transmission electron microscopy (HRTEM). The electrical properties of the deposited films were evaluated by spreading resistance profiler (SRP), by Van der Pauw, and by microwave-deduced photoconductivity decay (MW-PCD) measurements. Deposition rates of the as-grown Si films were in the range of 1-3 mu m min(-1) resulting in grain sizes varying from 0.1 to 6 mu m. The grain sizes of the deposited layer increases when the temperature or/and the input partial pressure of the reactant were raised. Additionally, preferred growth orientation conditions were found. Thus, crystallites grown between 900 and 1100 degrees C showed a maximum diffraction peak for the (2 2 0)-orientation. A highly resistive region was also observed at the silicon-graphite interface due to the formation of SiC agglomerates. (C) 1998 Elsevier Science B.V. All rights reserved.
引用
收藏
页码:386 / 392
页数:7
相关论文
共 12 条
[1]  
ANGERMEIER D, 1997, J ELECTROCHEM SOC, V144, P3261
[2]  
BERGMANN R, 1994, P 1 WORLD C PHOT EN, P1398
[3]   NUCLEATION AND GROWTH OF SILICON BY CVD [J].
BLOEM, J .
JOURNAL OF CRYSTAL GROWTH, 1980, 50 (03) :581-604
[4]   GROWTH-CHARACTERISTICS OF CVD BETA-SILICON CARBIDE [J].
CHENG, DJ ;
SHYY, WJ ;
KUO, DH ;
HON, MH .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1987, 134 (12) :3145-3149
[5]  
Hampden-Smith M. J., 1995, Advanced Materials, V7, P8
[6]   SILICON HOMOEPITAXY BY RAPID THERMAL-PROCESSING CHEMICAL VAPOR-DEPOSITION (RTPCVD) - A REVIEW [J].
HSIEH, TY ;
JUNG, KH ;
KWONG, DL ;
LEE, SK .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1991, 138 (04) :1188-1207
[7]   IN-SITU REAL-TIME MEASUREMENT OF THE INCUBATION-TIME FOR SILICON NUCLEATION ON SILICON DIOXIDE IN A RAPID THERMAL-PROCESS [J].
HU, YZ ;
DIEHL, DJ ;
LIU, Q ;
ZHAO, CY ;
IRENE, EA .
APPLIED PHYSICS LETTERS, 1995, 66 (06) :700-702
[8]   SUB-5 MU-M THIN-FILM CRYSTALLINE SILICON SOLAR-CELL ON ALUMINA CERAMIC SUBSTRATE [J].
ISHII, K ;
NISHIKAWA, H ;
TAKAHASHI, T ;
HAYASHI, Y .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS, 1993, 32 (6A) :L770-L773
[9]   THE EFFECT OF LOW-PRESSURE ON THE STRUCTURE OF LPCVD POLYCRYSTALLINE SILICON FILMS [J].
JOUBERT, P ;
LOISEL, B ;
CHOUAN, Y ;
HAJI, L .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1987, 134 (10) :2541-2545
[10]   THE GROWTH-CHARACTERISTICS OF CHEMICAL-VAPOR-DEPOSITED BETA-SIC ON A GRAPHITE SUBSTRATE BY THE SICL4/C3H8/H-2 SYSTEM [J].
LIN, TT ;
HON, MH .
JOURNAL OF MATERIALS SCIENCE, 1995, 30 (10) :2675-2681