Deposition of AuxAg1-xAuyAg1-y multilayersand multisegment nanowires

被引:21
作者
Ji, CX
Oskam, G
Ding, Y
Erlebacher, JD
Wagner, AJ
Searson, PC [1 ]
机构
[1] Johns Hopkins Univ, Dept Mat Sci & Engn, Baltimore, MD 21218 USA
[2] Johns Hopkins Univ, Dept Chem, Baltimore, MD 21218 USA
关键词
D O I
10.1149/1.1585053
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
AuxAg1-x/AuyAg1-y multilayers and multisegment nanowires were deposited from a single solution containing KAu(CN)(2), KAg(CN)(2), and Na2CO3 (pH 13). Cyclic voltammograms for deposition from solutions containing Au(CN)(2)(-) and Ag(CN)(2)(-) show the characteristic deposition peaks for gold and silver. The composition of the deposited alloys is dependent on the deposition potential (or current) and solution chemistry. Multisegment nanowires were prepared by sequential deposition at -0.7 and -1.2 V from solutions containing Au(CN)(2)(-) and Ag(CN)(2)(-) solution in porous Al2O3 templates. The different segments deposited at -0.7 and -1.2 V are clearly distinguished by scanning electron microscopy and optical microscopy under blue light illumination. (C) 2003 The Electrochemical Society.
引用
收藏
页码:C523 / C528
页数:6
相关论文
共 46 条
  • [1] GROWTH AND CHARACTERIZATION OF ELECTRODEPOSITED CU/CU-NI-CO ALLOY SUPERLATTICES
    ALPER, M
    APLIN, PS
    ATTENBOROUGH, K
    DINGLEY, DJ
    HART, R
    LANE, SJ
    LASHMORE, DS
    SCHWARZACHER, W
    [J]. JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, 1993, 126 (1-3) : 8 - 11
  • [2] ELECTRODEPOSITION OF HARD GOLD
    ANGERER, H
    IBL, N
    [J]. JOURNAL OF APPLIED ELECTROCHEMISTRY, 1979, 9 (02) : 219 - 232
  • [3] MAGNETORESISTANCE IN ELECTRODEPOSITED NI-FE-CU/CU MULTILAYERS
    ATTENBOROUGH, K
    HART, R
    LANE, SJ
    ALPER, M
    SCHWARZACHER, W
    [J]. JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, 1995, 148 (1-2) : 335 - 336
  • [4] BARD AJ, 1985, STANDARD POTENTIALS, pCH2
  • [5] GIANT MAGNETORESISTANCE OF NANOWIRES OF MULTILAYERS
    BLONDEL, A
    MEIER, JP
    DOUDIN, B
    ANSERMET, JP
    [J]. APPLIED PHYSICS LETTERS, 1994, 65 (23) : 3019 - 3021
  • [6] Microstructure of Ni-Cu multilayers electrodeposited from a citrate electrolyte
    Bonhote, C
    Landolt, D
    [J]. ELECTROCHIMICA ACTA, 1997, 42 (15) : 2407 - 2417
  • [7] Brenner A., 1963, ELECTRODEPOSITION AL, V2, P589
  • [8] ELECTRODEPOSITION OF GOLD BY PULSED CURRENT
    CHEH, HY
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1971, 118 (04) : 551 - &
  • [9] Chrzanowski W, 1996, J APPL ELECTROCHEM, V26, P385, DOI 10.1007/BF00251323
  • [10] LOW-STRESS GOLD ELECTROPLATING FOR X-RAY MASKS
    CHU, W
    SCHATTENBURG, ML
    SMITH, HI
    [J]. MICROELECTRONIC ENGINEERING, 1992, 17 (1-4) : 223 - 226