Modeling of APCVD-doped silicon dioxide deposition process by a modular neural network

被引：2

作者：

Di Natale, C ^{[1
]}

Proietti, E

Diamanti, R

D'Amico, A

机构：

[1] Univ Roma Tor Vergata, Dept Elect Engn, I-00133 Rome, Italy

[2] Texas Instruments Italia SPA, Avezzano, AQ, Italy

来源：

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING | 1999年 / 12卷 / 01期

关键词：

APCVD process; neural network;

D O I：

10.1109/66.744532

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This paper describes a methodology based on the combined utilization of both a multisensor system and an optimized artificial neural network that has been applied to equipment utilized for the production of doped silicon dioxide films. The model exhibits an average relative error around 1% in predicting the concentrations of dopants and the thickness of the oxide layer. One of the major benefits of such a predictor is the ability of providing an on-line estimate of the process yield, thus avoiding off-line testing and gaining a significant reduction of risks of wafer loss. The neural model here described is currently utilized as a control tool at the Texas Instruments Avezzano, Italy, plant.

引用

页码：109 / 115

页数：7

共 11 条

[1] Modeling the growth of PECVD silicon nitride films for solar cell applications using neural networks [J].

Han, SS ;

Cai, L ;

May, GS ;

Rohatgi, A .

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 1996, 9 (03) :303-311

[2] ADVANTAGES OF PLASMA ETCH MODELING USING NEURAL NETWORKS OVER STATISTICAL TECHNIQUES [J].

HIMMEL, CD ;

MAY, GS .

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 1993, 6 (02) :103-111

[3]

HUANG Y, 1993, IEEE T SEMICONDUCT M, V7, P333

[4] Adaptive Mixtures of Local Experts [J].

Jacobs, Robert A. ;

Jordan, Michael I. ;

Nowlan, Steven J. ;

Hinton, Geoffrey E. .

NEURAL COMPUTATION, 1991, 3 (01) :79-87

[5]

JORDAN MI, 1992, ADV NEUR IN, V4, P985

[6]

Kohonen T., 1997, Self-organizing Maps, V2nd ed.

[7]

MAREN FA, 1990, HDB NEURAL COMPUTING

[8] Semi-empirical neural network modeling of metal-organic chemical vapor deposition [J].

Nami, Z ;

Misman, O ;

Erbil, A ;

May, GS .

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 1997, 10 (02) :288-294

[9] A neural network model of a contact plasma etch process for VLSI production [J].

Rietman, EA .

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 1996, 9 (01) :95-100

[10] USE OF NEURAL NETWORKS IN MODELING SEMICONDUCTOR MANUFACTURING PROCESSES - AN EXAMPLE FOR PLASMA ETCH MODELING [J].

RIETMAN, EA ;

LORY, ER .

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 1993, 6 (04) :343-347

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