Microstructure gradient in 60Sn40Pb solder joints annealed under an external electric field

被引:8
作者
Jung, K [1 ]
Conrad, H [1 ]
机构
[1] N Carolina State Univ, Dept Mat Sci & Engn, Raleigh, NC 27695 USA
关键词
D O I
10.1023/B:JMSC.0000016189.01285.35
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Influence of an electric field on the difference in the microstructure gradient in 60Sn40Pb solder joints was investigated. It was found that coarsening rate for 60Sn40Pb alloy decreased when kept with the retarding effect of an external electric field. It was observed that rate of coarsening could occur to a greater extent from a greater depletion of negatively charged vacancies due to their migration to the positively charged surface. The result shows that the depletion of the charged vacancies by their motion to the charged surface was the main reason behind the coarsening and separation in the 60Sn40Pb alloy.
引用
收藏
页码:1803 / 1804
页数:2
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