Pulse and pulse reverse plating - Conceptual, advantages and applications

被引：699

作者：

Chandrasekar, M. S. ^{[1
]}

Pushpavanam, Malathy ^{[1
]}

机构：

[1] Cent Electrochem Res Inst, Karaikkudi 630006, Tamil Nadu, India

来源：

ELECTROCHIMICA ACTA | 2008年 / 53卷 / 08期

关键词：

pulse current (PC) electrodeposition; pulse reverse current (PRC); individual metals and their alloys; composites and semiconductor; applications;

D O I：

10.1016/j.electacta.2007.11.054

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

A review on pulse and pulse reverse techniques for electrodeposition have been attempted. Pulse electrodeposition (PED) of some metals and alloys are reported. The effects of mass, transport, electrical double layer pulse parameters and current distribution on surface roughness and morphology are presented. Applications, advantages and disadvantages of PC and PRC techniques are discussed along with theoretical aspects and mechanism. (C) 2007 Elsevier Ltd. All rights reserved.

引用

页码：3313 / 3322

页数：10

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