Surface properties of chemically modified polyimide films

Surface modification of Kapton polyimide film (325 nm thick) by means of chromic acid and perchloric acid at different times and temperatures has been carried out. The contact angle of water decreased from 82 to 55 degrees and the surface energy increased accordingly from 26 to 45 mJ/m(2) with times of etching by chromic acid up to 45 min at 33 degrees C. Etching at higher temperatures increased the surface energy. Chromic acid was more effective than perchloric acid. IR and XPS studies indicated multiple bonding and generation of poler groups on the surface. The peak at 1778 cm(-1) due to the imide group decreased on acid etching. The O/C ratio increased and the N/C ratio decreased. The peel strength of the joint polyimide film/copper film/epoxy adhesive/aluminium sheet increased about two-fold on modification of the polyimide (PI) film at 33 degrees C for 45 min, although the changes were marginal for the PI film/silicone rubber/PI film joint. The peel strength is a function of the time and temperature of etching.