Study of interaction between polyimide and Cu under a high humidity condition

被引：10

作者：

Nagai, N ^{[1
]}

Hironaka, T ^{[1
]}

Imai, T ^{[1
]}

Harada, T ^{[1
]}

Nishimura, M ^{[1
]}

Mimori, R ^{[1
]}

Ishida, H ^{[1
]}

机构：

[1] Toray Res Ctr Ltd, Otsu, Shiga 5208567, Japan

来源：

APPLIED SURFACE SCIENCE | 2001年 / 171卷 / 1-2期

关键词：

polyimide (PI); copper (Cu); Cu carboxylate; FT-IR; transmission electron microscope (TEM); TEM-EDX; high humidity;

D O I：

10.1016/S0169-4332(00)00539-0

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Polyimide (PI) films coated on Cu films were treated under a high humidity condition. FT-IR RAS measurements have clarified the interface reactions of Cu with PI, the hydrolysis of imide functional group and formation of Cu carboxylate. From the calculation of RAS spectra measured at various incident angles. the diffusion of Cu carboxylate was confirmed from interface to the surface of PI. The diffusion length of Cu carboxylate ranges about 1 mum from Cu interface. The RAS result coincides with the ATR depth profile result and TEM-EDX image. Transmission electron microscope (TEM) images show that Cu diffuses mainly into the Cu carboxylate formation under our high humidity condition. (C) 2001 Elsevier Science B.V. All rights reserved.

引用

页码：101 / 105

页数：5

共 9 条

[1]

[Anonymous], OPTICAL PROPERTIES T

[2] Calculation of various physics constants in heterogenous substances I Dielectricity constants and conductivity of mixed bodies from isotropic substances [J].